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| Structure
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Roth & Rau AG |
|
 |
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| Dünnschicht Solar GmbH |
|
100% |
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| Roth & Rau Microsys. GmbH |
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100% |
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| CTF Solar GmbH |
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100% |
|
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| Shanghai Trading Co. Ltd. |
|
100% |
|
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| Singapore Pte. Ltd. |
|
100% |
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| Korea Co. Ltd. |
|
100% |
|
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| Switzerland AG |
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100% |
|
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| Australia Pty Ltd. |
|
100% |
|
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| USA Inc. |
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100% |
|
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| India Pvt. Ltd. |
|
100% |
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| |
|
01 |
High Tech for Surfaces
|
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 |
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Innovative Products and Technologies for Future-Oriented Applications |
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- Smallest amount of etching depth: 5 nm
- Uniform processing of the whole wafer (diameter: 6") within 15 minutes, average process time: 5 minutes (depending on the initial surface profile)
- Etching rate: ≥ 3 nm/min. (depending on the coating material)
- Uniformity across a 6" wafer: < 2 %, average uniformity across a 6" wafer (1-): < 0.5 %, Uniformity from wafer to wafer: < 2 %
|
 Topic
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 |
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Entrepreneur
des Jahres® |
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Winner 2009
Nominated for the
World Entrepreneur
of the Year 2010
official
site
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Events |
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16.09.2010 |
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Anniversary "20 Years of AIS Automation Dresden"
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