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| Structure
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Roth & Rau AG |
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| Dünnschicht Solar GmbH |
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100% |
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| Roth & Rau Microsys. GmbH |
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100% |
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| CTF Solar GmbH |
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100% |
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| Shanghai Trading Co. Ltd. |
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100% |
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| Singapore Pte. Ltd. |
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100% |
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| Korea Co. Ltd. |
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100% |
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| Switzerland AG |
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100% |
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| Australia Pty Ltd. |
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100% |
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| USA Inc. |
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100% |
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| India Pvt. Ltd. |
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100% |
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01 |
High Tech for Surfaces
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Innovative Products and Technologies for Future-Oriented Applications |
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Ion Scan 800 process module and vacuum robot platform for wafer handling
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Handling platform with 4 ports for connection with up to 2 Ion Scan Process modules
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SEMI standard cassette-to-cassette wafer handling
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The IonScan 800 system is a high-end production plant for the coating thickness trimming of thin coatings as well as for the correction of polishing faults in the area of semiconductor industry and precision optics.
The coating thickness trimming is performed in the form of a meandered scanning of the surface using a focused ion beam. The dwell time of the ion beam at a specific place of the wafer determines the height of the material removal through ion beam sputtering.
A coating thickness trimming is realized for the individual wafer by controlling the dwell time profile on rastering. Using a complex calculation algorithm, any wafer-specific surface fault profiles can be corrected precisely and surfaces can be smoothed. In this way, the production yield can be increased significantly.
Based on ion beam sputtering, the IonScan technology is a universally applicable method for any materials, any type of surface faults and a wide spectrum of substrate shapes. The IonScan system can be equipped with various ion beam source types that are suitable for the operation with inert gasses and, in addition, for the reactive gas operation.
FIELDS OF APPLICATION
IonScan is a precision processing system for the coating thickness trimming and for the polishing fault correction with a precision that has never achieved by any other technology. At that, the achievable precision is within a range of a few nanometers or better.
Fields of application are:
- Coating thickness trimming for Bulk Acoustic Wave (BAW) and Surface Acoustic Wave (SAW) devices
- Considerable improvement of polishing result of chemical-mechanical polishing methods
- Correction of polishing faults for components in the area of precision optics
- Realization of defined gradient coatings and structures
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Downloads:
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11729493881.pdf (388 kB)
Ultra-precise film thickness trimming for Semiconductor Technology
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 Topic
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Coating Thickness Correction and Post CMP Processing
APPLICATIONS
- Frequency adjustment of SAW/BAW components, capacitors and resistors
- Post CMP processing of TFH components
SUBSTRATES
- Si and AlTiC wafers of 4" and 5" with diameters of 156 mm and 210 mm
PLANT PARAMETERS
- Cluster tool with up to 3 process chambers and a SEMI-standard wafer handling system
- Cassettes with indexer, wafer alignment and bar code reader
- 4-axis precision moving and positioning system
- As an alternative, deliverable with Kaufman or RF (ICP) ion beam source
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Topic
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Polishing Fault Correction as well as precision Ion Beam Etching
TECHNOLOGY
- Large-area IonScan technology, optionally as two-stage process with pre-etching process by means of linear ion beam source (RIBE with fluorine chemistry) and standard IonScan process for the fine processing
APPLICATIONS
- Polishing and fault correction of optical surfaces
- Precision etching of optical grids
SUBSTRATES
- Optical substrates of up to 300 x 300 x 10 cu.mm
PLANT PARAMETERS
- Single process chamber with automatic single substrate transfer
- 4-axis precision moving and positioning system
- As an alternative, deliverable with Kaufman or RF (ICP) ion beam source and, optionally, with additional ECR linear ion beamsource for pre-etching process
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Topic
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Entrepreneur
des Jahres® |
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Winner 2009
Nominated for the
World Entrepreneur
of the Year 2010
official
site
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Events |
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16.09.2010 |
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Anniversary "20 Years of AIS Automation Dresden"
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