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| Konzern
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Roth & Rau AG |
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 |
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| Dünnschicht Solar GmbH |
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100% |
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| Roth & Rau Microsys. GmbH |
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100% |
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| CTF Solar GmbH |
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100% |
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| Shanghai Trading Co. Ltd. |
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100% |
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| Singapore Pte. Ltd. |
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100% |
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| Korea Co. Ltd. |
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100% |
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| Switzerland AG |
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100% |
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| Australia Pty Ltd. |
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100% |
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| USA Inc. |
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100% |
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| India Pvt. Ltd. |
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100% |
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01 |
High Tech für Oberflächen
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Innovative Produkte und Technologien für zukunftsorientierte Anwendungen |
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• Smallest amount of etching depth 5nm
• Uniform processing of the whole wafer (6“ Dm) within 15 min, average process time 5 min (depending on the initial surface profile)
• Etching rate >/= 3 nm/min (depending on the layer material)
• Uniformity over a 6“ wafer < 2 %, average uniformity over a 6“ wafer (1-) < 0,5 %, Uniformity wafer to wafer < 2 %
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 Seitenanfang
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Karriere |
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Events |
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13.-17.09.2010 |
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PSE (Roth & Rau MicroSystems GmbH)
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